VIA Filling

Importance in Fine Precision Interconnecting VIAs and Printed Circuit Boards (PCBs)

nScrypt offers extreme volumetric control for via filling applications. Our team has experience with filling vias as small 50 microns for manufacturing applications and the capability to go smaller. nScrypt continues to push the envelop for Micro Dispensing applications within electronics packaging.

nScrypt offers novel methods for formation of ultra high aspect ratio vias. The process is not limited to vertical vias and can create freeform vias with complex geometries for electronic or thermal applications.