Laser Machining Processing Equipment Manufacturer
nScrypt Inc provides complete laser machining solutions for difficult applications. We incorporate picosecond lasers on our standard, precision motion platforms to deliver high quality micro laser machining capability to the semiconductor, electronics, aerospace, medical, solar and many other industries. When speed is more important, the nScrypt motion platform can be configured with other laser alternatives such as nanosecond and CO2 solutions.
We understand that the right laser is only part of the solution. Having the proper optics for your process is equally important. With our deep experience in specialized optics, we will specify and integrate the optics your process requires; from beam shaping to spot size, we will precisely design for you.
Performance and Precision with our Picosecond Laser Machining
With repetition rates up to 1MHz and high average power, solid state picosecond lasers are able to achieve cost effective, high quality micro laser machining. With picosecond pulses there is little to no heat affected zone when machining. This benefit eliminates micro cracking of sensitive substrates. Compared to femtosecond lasers, picosecond lasers produce similar ablation characteristics, are easier to maintain, and can perform similar operations 5 times faster. Being able to obtain a power density in the TW/cm2 regime allows for the micro laser machining of most materials.
Our team of laser experts is available to discuss the micro laser machining system right for you.
Laser Sintering
Laser sintering is easy when dealing with high temperature substrates. The complexity enters in when using lasers to sinter electronic materials or to thermally induce biological materials. nScrypt has mastered material handling in these instances. When using a laser to sinter a high temperature material on plastic, our method makes the difference between success and failure. No two materials are the same and this variety drives our focus on providing a solution.
Environmental Scanning Electron Microscope (ESEM) photo of as-deposited silver paste.
Environmental Scanning Electron Microscope (ESEM) photo of laser-sintered silver paste laser machining.
Laser Ablation
Whether drilling vias, cutting edges, trimming resistors or milling patterns for layered electronics, the femtosecond laser demonstrates a clear advantage compared to traditional nanosecond lasers. In the photos below, both substrates are polyimide, a low temperature substrate. The photo to the left shows the surface bubbling and creviced. This is due to excess heat the nanosecond laser induces on the substrate. The photo to the right, using the same magnification, shows a smooth and polished surface.
Edge view of Kapton cut with 150 nanosecond (ns) laser machining.
Edge view of Kapton cut with 120 femtosecond (fs) laser machining