Dispensing Systems
Whitepapers and Presentations

Direct 3D Printing of Vertical Interconnects for Stacked Die using Micro Dispensing Pump Systems Technology

Vertical interconnecting for stacked die has challenged a variety of technical approaches. nScrypt presents a method using direct print 3D printing via micro dispensing of a viscous conductor, demonstrating the necessary control in both volume and space. Dispensing for packaging has been common, but the packages have been large, therefore it is a critical step to control the volume to 10's of pico-liters through a dispensed nScrypt SmartPump™ orifice to obtain the necessary tolerances for smaller pads and tighter pitches which exist on stacked die. The micro dispensing systems approach has demonstrated very fine features, less than 50 micro-meters, given the proper material. Explanations on the limits of materials are presented as given by particle size and post processing temperatures with regard to micro dispensing and vertical interconnects. Printing vertically on multiple sides is demonstrated along with a detailed explanation of the necessary spatial control for the resolution that will match the die level as opposed to resolutions matching much larger packages. As the stacked die change the pattern for connection or the number of stacks change, the advantage this approach brings is the Computer Aided Dispensing control. This implies no masks and the ability to change from part to part without expensive tool redesign time.

Vertical Interconnects for Stacked Die
Micro Dispensing Systems Video